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If you want to search by HS Code (2022 Version) please enter 2 (Chapter), 4 (Sub-chapter), 6 (Sub-heading) or 8 (Commodity Code) digits

8486901600 - - - - Of machines for sawing monocrystal semiconductor boules into slices, or wafers into chips:- - - Of grinding, polishing and lapping machines for processing of semiconductor wafers